Product Introduction
● This machine is primarily used for cutting hard and brittle materials such as crystal, artificial gemstones, single-crystal silicon, ceramics, glass, precious metals, and magnetic materials.
● It utilizes a dual-station worktable positioned below for higher cutting efficiency.
● Each station has 21 cutting units, each capable of cutting 170mm x 70mm x 160mm.
● It utilizes a horizontally movable worktable.
Technical Parameters
Maximum workpiece size (width × length × height)mm | 170×70×160×42 board (double station) |
Cutting disc thickness range(mm) | 1-70 Straight film/R≥6,Chord height ≤ 25 arc pieces |
Sheave parameters(mm) | Φ160X1430 three-guide wheel shaft + guide wheel |
Workbench lifting stroke(mm) | Max 180 |
Cutting line speed(m/min) | Highest 1200 |
Maximum line storage capacity(m) | 20000(0.2 Diamond Wire) |
Steel wire diameter(mm) | 0.10-0.3 |
Total rated power(kW) | 66.5 |
Machine weight | 9000kg |
Host dimensions (width × length × height)(mm) | 2240×3100×2380 |
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